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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing

Year : 2002 Volume number : 25 Issue: 03

Interfacial Reaction Studies On Lead (Pb)-Free Solder Alloys (Article)
Subject: Dissolution
Author: Joowoon Kang     
page:      155 - 161
Interfacial Reactions Between Lead-Free Snagcu Solder And Ni(P) Surface Finish On Printed Circuit Boards (Article)
Subject: Interface
Author: G. T. Zheng     
page:      162 - 167
Wetting Characteristics Of Pb-Free Solder Alloys And Pwb Finishes (Article)
Subject: Soldering Error
Author: J Dang     
page:      168 - 184
Microstructure, Joint Stength And Failure Mechanisms Of Snpb And Pb-Free Solders In Bga Packages (Article)
Subject: Activation Energy
Author: M Li     
page:      185 - 192
Pb-Free Sn/3.5 Ag Electroplating Bumping Process And Under Bump Metallization (Ubm) (Article)
Subject: Electric Drive
Author: Y Jang     
page:      193 - 202
Time Series Modeling Of Photosensitive Polymers Development Rate For Via Formation Applications (Article)
Subject: Mcmc , Neural Network
Author: A Kim     
page:      203 - 209
Reliabilty Investigation Ofhard Core Solder Bumps Using Mechanical Palladium And Snpb Solder (Article)
Subject: Flip Chi P
Author: I Opperemann     
page:      210 - 216
Mechanical Fatigue Test Method For Chip/ Underfill Declamination In Flip-Chip Packages (Article)
Subject: Flip Chi P , Fatigue
Author: Kenji Hirohata     
page:      217 - 222
Comprehensive Treatment Of Moisture Induced Failure-Recent Advances (Article)
Subject: Finite Element
Author: P.S Wong     
page:      223 - 230
Characteristics And Reliabity Of Fast-Flow, Snap-Cure, And Reworkable Underfills For Solder Bumped Flip Chip On Low-Cost Sustrates (Article)
Subject: Reliability
Author: K. K Lau     
page:      231 - 239